Process capability (TO-can Package) |
| TO-can package |
General Spec |
| Position Accuracy |
±50μm |
| LD Rotation Accuracy |
±1.5 ° |
| LD Shear Force |
>100g |
| SM Shear Force |
>300g |
| PD Shear Force |
>300g |
| Wire Pull Strength(1.0mil) |
>3.0g |
| Dew Point |
<-20˘J |
| Capping Accuracy |
±70μm |
| B/I Temp Accuracy |
±5˘J |
| O/E Test Accuracy |
2% |
|
| PSĄG |
1.All processes are located in clean room (class 10K). |
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2.It can be customerized if there is special request. |
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Process capability (QFN Package) |
| QFN Package |
General Spec |
| Minimim QFN device size |
3mmx3mm |
| Surface Mount accuracy |
±50μm |
| Minimum SMT chip size |
0402 |
| Die bond accuracy |
±50μm |
| Die bond Shear force |
>300g |
| Wire Pull Strength (0.9mil Au wire) |
>3g |
| Molding thickness(mm) |
0.6mm, 0.8mm, 1.2mm |
| Dicing accuracy |
±30μm |
| PA module test |
customerize |
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| PSĄG |
1.All processes are located in clean room (class 10K). |
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2.It can be customerized if there is special request. |
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