Process capability (TO-can Package) |
TO-can package |
General Spec |
Position Accuracy |
±50μm |
LD Rotation Accuracy |
±1.5 ° |
LD Shear Force |
>100g |
SM Shear Force |
>300g |
PD Shear Force |
>300g |
Wire Pull Strength(1.0mil) |
>3.0g |
Dew Point |
<-20Ž |
Capping Accuracy |
±70μm |
B/I Temp Accuracy |
±5Ž |
O/E Test Accuracy |
2% |
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PSF |
1.All processes are located in clean room (class 10K). |
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2.It can be customerized if there is special request. |
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Process capability (QFN Package) |
QFN Package |
General Spec |
Minimim QFN device size |
3mmx3mm |
Surface Mount accuracy |
±50μm |
Minimum SMT chip size |
0402 |
Die bond accuracy |
±50μm |
Die bond Shear force |
>300g |
Wire Pull Strength (0.9mil Au wire) |
>3g |
Molding thickness(mm) |
0.6mm, 0.8mm, 1.2mm |
Dicing accuracy |
±30μm |
PA module test |
customerize |
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PSF |
1.All processes are located in clean room (class 10K). |
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2.It can be customerized if there is special request. |
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