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Assembly and Testing Services for Sensor and Power Amplifier |
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| Type |
Structure |
Application |
Package |
| CMOS sensor |
Multi chips |
Mouse |
DIP pre-mold |
| CMOS sensor |
Multi chips |
Image device |
CLCC , PLCC |
| MEMS sensor |
Multi chips |
Motion detection |
CLCC |
| SMD device |
Molding |
Power Amplifier |
QFN type |
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